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App Windows Comsol Multiphysics 5.5 Update 3

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Comsol Multiphysics 5.5 Update 3 | 4.5 Gb
The Comsol product team is pleased to announce the availability of COMSOL Multiphysics 5.5 Update 3. This update contains performance and stability improvements to COMSOL Multiphysics, COMSOL Server, and COMSOL Client.

COMSOL Software version 5.5 Update 3 - Released February 25, 2020
All COMSOL software products undergo stability improvements that are introduced as updates. The following list contains the most important improvements in COMSOL version 5.5 update 3 (including those of update 1 and update 2).


COMSOL Multiphysics
- For the PID Controller add-in, the coefficients of the proportional and integral terms have changed signs to conform with standard conventions, and it is no longer necessary to specify units for coefficients or terms with the value 0.
- The system requirements for the license manager have been expanded to now also support Debian 6, Red Hat Enterprise Linux/CentOS 6, and SUSE Enterprise Linux 11.4 and newer.
- Fixed a problem with the evaluation of time derivatives of dependent variables from a different frequency domain solution using the withsol operator during assembling.
- Improved the refresh action of the Application Libraries window.
- Disabled the Run Application button in the Application Libraries window for application previews.
- Upgraded the Tomcat server to version 7.0.99.
- Reduced window padding for applications running in a web browser.
- Pressing the X, Y, or Z key to control rotation in the Graphics window now works on macOS.
- The solver sequence now shows the storage format that will be used when running on a cluster.
- A problem has been fixed where a running COMSOL® instance could lose contact to the license server if the license file was changed on the license server.
- Performance improvements.
- A problem has been fixed in the COMSOL Installer that under certain conditions may cause the uninstallation of a LiveLink for CAD product.
- Removes a risk for client/server connection problems.
COMSOL Compiler
- For standalone applications compiled with the Download option, the download of COMSOL Runtime is more stable.
COMSOL Server
- Upgraded the Tomcat server to version 7.0.99.
AC/DC Module
- Stability improvement of divergence cleaning for boundary coils with symmetry cuts.
- Corrected a problem with the calculation of accurate concatenated flux for boundary coils.
Acoustics Module
- The computation of the arrival time of rays at the Receiver dataset has been improved to give more accurate results for direct sound and for rays that undergo reflections at a boundary near the receiver.
Batteries and Fuel Cells Module
- New electrode material (NMC 811) added to the Batteries & Fuel Cells material library.
CAD Import Module, Design Module and LiveLink Modules for CAD
- The CAD file import functionality has been extended to support new versions for the following file formats:
ACIS (.sat, .sab, .asat, .asab): 2020 1.0
AutoCAD (.dxf, .dwg): 2020
Inventor (.iam, .ipt): 2020
NX (.prt): 1872
SOLIDWORKS (.sldprt, .sldasm): 2020
CFD Module
- Fixed slip velocity definition in the Mixture Model multiphysics coupling for Phase Transport.
- Fixed drag coefficient definition for the Haider-Levenspiel model in the Mixture Model multiphysics coupling for Phase Transport.2
Composite Materials Module
- Extended the number of configurations that are supported for slits in composite materials.
File Import for CATIA V5
- Support has been added to import CATIA V5 (.CATPart, .CATProduct) version 2020 files.
Heat Transfer Module
- For radiation in semitransparent media, wavelength-dependent properties for 2D axisymmetric geometries are now enabled.
- The heat transfer coefficient for a spherical pellet bed in the Local Thermal Nonequilibrium multiphysics interface has been corrected.
- Fixed variables definition on isothermal domain interfaces for coupling with surface-to-surface radiation.
LiveLink for MATLAB
- Exporting animations from MATLAB now works when the server is running on another computer.
Nonlinear Structural Mechanics Module
- You can now compute plasticity in the Shell interface with multiple interfaces. Previously, applying plasticity on several domains associated with different materials generated an error about duplicate variables names.
Optimization Module
- The derivative-free optimization methods now support the Polynomial Boundary shape optimization feature.
Particle Tracing Module
- When using the Massless formulation and enabling out-of-plane degrees of freedom in the Charged Particle Tracing or Particle Tracing for Fluid Flow interfaces, you can now specify the out-of-plane velocity component in the Particle Properties Settings window. Previously, only the in-plane components would be shown.
- Fixed an error where the settings for the lognormal particle diameter distribution did not appear properly in the Release from Data File feature settings.
- Fixed an error in the equation display for the Boundary Load node in the Particle Tracing for Fluid Flow interface.
- Ensured that the acoustophoretic force can get the correct value of the frequency used to compute the acoustic pressure field, even if the frequency domain study for pressure acoustics does not immediately precede the time-dependent study for particle tracing (for example, if they are Study 1 and Study 3 in a model).
- The software now automatically disables the Symmetry node in the Charged Particle Tracing and Particle Tracing for Fluid Flow interfaces if the Massless formulation is used.
- Fixed an error that occurred when selecting an initial particle velocity distribution and then switching the formulation to Massless.
- When using the null collision method for Monte Carlo collision modeling with the Charged Particle Tracing interface, the choice to apply the collisions to only a single species is now respected.
- Fixed an error that occurred when using the options to include rarefaction effects and to specify a particle diameter distribution in the Particle Tracing for Fluid Flow interface.
- Improved the robustness of the Particle Counter and Ray Detector features when used with a parametric sweep over multiple parameter values.
Porous Media Flow Module
- The following additional domain conditions and boundary conditions are now available for the Heat Transfer in Fractures interface with licenses for the Subsurface Flow Module or the Porous Media Flow Module:
. Domains: Heat Source

. Boundaries: Temperature, Heat Flux, Heat Source, and Surface-to-Ambient Radiation
Ray Optics Module
- Fixed an error in the release of diffraction orders from a grating or cross grating when the reflectance or transmittance of a given order (but not both) is exactly zero.
- Fixed an error in the perturbation due to surface roughness for the Illuminated Surface feature in 2D.
- Fixed an error when the Include surface roughness check box was selected in some, but not all, of the Illuminated Surface nodes in a geometrical optics model.
- Fixed a crash when adding a Height attribute to the Optical Aberration Description, while also applying a filter to the rays.
- Adjusted the equation display for the Material Discontinuity node so that the symbols for the transmission and reflection coefficients are more consistent.
- For ray release features that display the total number of rays released in a conical distribution, the number shown is now correctly updated after changing the number of azimuthal or polar angles.
- Fixed an error in the equation display for the Diffraction Order node in the Geometrical Optics interface.
- When releasing rays with one of the conical distributions, Hexapolar or Specify polar and azimuthal distributions, you may now enter zero for the number of polar angles. This will cause a single ray to be released along the cone axis.
RF Module
- Fixed a bug resulting in Polar and Smith Description groups becoming empty when rendered in the web client.
Semiconductor Module
- Fixed an error in 5.5 update 1 that disallows the selection of the WKB tunneling option in Schottky contacts.
- Stability improvement for very rare cases of interference between the Plasma Module and the Semiconductor Module.
Structural Mechanics Module
- Corrected a problem where an error occurred when generating an Eigenfrequency solver sequence. This could happen on some computers if a comma was selected as the decimal separator in the system settings.
- Corrected a problem where the integration in the rms and m operators for random vibration could return erroneous results.









BURLINGTON, MA, Nov 18, 2019 - COMSOL, the leading provider of software solutions for multiphysics modeling, simulation, and application design and deployment, announces the latest version of its COMSOL Multiphysics software. In version 5.5, the Design Module provides an entirely new sketching tool for easier creation and more versatile parametric control of geometry models. New and updated solvers speed up a wide range of simulations. Two new add-on products, the Porous Media Flow Module and the Metal Processing Module, further expand the product suite's multiphysics modeling power.
A multifaceted and collaborative development process leads to success at Samsung. The COMSOL team visited the Samsung Audio Lab to hear from Allan Devantier and Andri Bezzola about how simulation helps them develop optimized products faster, and even design innovative products. Simulation is an important part of loudspeaker design, as it allows you to account for the inherent nonlinearities involved in acoustics and to examine all of the physical effects simultaneously. To get accurate and reliable results, it's crucial to validate simulation results with testing. At Samsung, the simulation engineer develops an optimized design. The loudspeaker is then tested in anechoic chambers and through blind listening tests. Another unique aspect of the Samsung Audio Lab is that simulation, development, and testing all take place under one roof. In addition, simulation applications help the team collaborate effort effectively. That's why Samsung uses COMSOL Multiphysics® to develop loudspeaker designs.






COMSOL Inc. is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation applications. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electromagnetics, structural, acoustics, fluid flow, heat transfer, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on COMSOL Server to deploy applications to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL has 19 offices worldwide and extends its reach with a network of distributors.
Product: Comsol Multiphysics
Version: 5.5.0 Update 3 (Build 359)
Supported Architectures: x64
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Language: multilanguage
System Requirements: PC / macOs / Linux *
Supported Operating Systems: *
Size: 4.5 Gb


These requirements are common to all platforms:
- A working network card and internet connection are recommended during installation
- At least 4 GB of RAM is recommended
- 2-10 GB of disk space, depending on your licensed products and installation options
- Adobe Acrobat Reader to view and print the COMSOL documentation in PDF format
- An Intel or AMD 64-bit processor based on the Intel 64 or AMD64 architecture *
* A processor with the SSE4 instruction set is required for the Design Module on Linux. Intel processors released 2009 or later and AMD processors released 2012 or later satisfy this requirement.
Operating System Requirements
Windows 10
Windows 10 Pro for Workstations
Windows 8.1
Windows 7 SP1
Windows Server 2019
Windows Server 2016
Windows Server 2012 R2
Windows Server 2012
Windows Server 2008 R2 SP1
Windows HPC Server 2008 R2 SP1
macOS 10.13, 10.14, and 10.15
Debian 8, 9 and 10
Red Hat Enterprise Linux 7.7 and 8.0
CentOS 7.7 and 8.0
Ubuntu 16.04, and 18.04
SUSE Linux Enterprise Desktop 15 SP1
OpenSUSE Leap 15 and 15.1

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